Inline Processing Machines

SEALine XL

Optimized system for n-type Inline application

Various Inline Applications

• HF/Metal Cleaning
• RCA & O3 Cleaning
• Developing / Etching / Striping
• Electrical deposition

Various Cleaning Solutions

• Roller brush / Disc brush
• Bubble jet
• Ultrasonic / Plasma

Capable Si wafer size

• Upto M12 (210 x 210mm)