• Alkaline / Acidic texturing / Oxidation
• pSC1 / SC2 / O3 cleaning
• TOPCon, PERC, HIT
• 600 wafers load
• Upto 12,000 w/h
• Upto M12 (210 x 210mm)
• RCA / SPM / HFO3 / DIO3 cleaning
• Developing / Etching / Stripping
• Oxidation / Special drying
• Si wafer up to 300mm • Glass / Ceramics up to 500x500mm
• RCA cleaning < 30EA
• Dry < 30EA